Quiescent current leakage test of the VDD supply (IDDQ Test) has been proven an
effective way to screen out defective chips in manufacturing of Integrated Circuits (IC).
As technology advances, the traditional IDDQ test is facing more and more challenges. In
this research, a practical built-in current sensor (BICS) is proposed and the design is
verified by three generations of test chips. The BICS detects the signal by sensing the
voltage drop on supply lines of the circuit under test (CUT). Then the sensor performs
analog-to-digital conversion of the input signal using a stochastic process with scan chain
readout. Self-calibration and digital chopping are used to minimize offset and low
frequency noise and drift. This non-invasive procedure avoids any performance
degradation of the CUT. The measurement results of test chips are presented. The sensor
achieves a high IDDQ resolution with small chip area overhead. This will enable IDDQ of
future technology generations.
| Identifer | oai:union.ndltd.org:tamu.edu/oai:repository.tamu.edu:1969.1/3211 |
| Date | 12 April 2006 |
| Creators | Xue, Bin |
| Contributors | Walker, Duncan M. |
| Publisher | Texas A&M University |
| Source Sets | Texas A and M University |
| Language | en_US |
| Detected Language | English |
| Type | Book, Thesis, Electronic Dissertation, text |
| Format | 1490655 bytes, electronic, application/pdf, born digital |
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