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Experimental evaluation of board level solder joint reliability of plastic ball grid array assemblies with eutectic Pb-Sn and Pb-free solders /

Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references (leaves 103-114). Also available in electronic version. Access restricted to campus users.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/52054138
Date January 2003
CreatorsLui, Hoi Wai.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceView Abstract or Full-Text.

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