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Study of Sn-Ag-Cu reliability through material microstructure evolution and laser moire interferometry

Thesis (Ph.D.)--Mechanical Engineering, Georgia Institute of Technology, 2009. / Committee Chair: Sitaraman, Suresh.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/429511571
Date January 2008
CreatorsTunga, Krishna Rajaram.
PublisherAtlanta, Ga. : Georgia Institute of Technology,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceAvailable online, Georgia Institute of Technology:

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