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Thermo-mechanical reliability models for life prediction of ball grid arrays on Cu-core PCBs in extreme environments

Thesis--Auburn University, 2007. / Abstract. Vita. Includes bibliographic references (p.181-188).

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/436169775
Date January 2007
CreatorsDrake, Jonathan Luke, Lall, Pradeep.
PublisherAuburn, Ala. ,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

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