Computational stress analysis for ball grid array reliability and passive component reliability in board level assemblies /

Description

Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2005. / Includes bibliographical references (leaves 85-90). Also available in electronic version.

Links & Downloads

1. http://library.ust.hk/cgi/db/thesis.pl?MECH%202005%20LAU

Tags

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/71216584
Date	January 2005
Creators	Lau, Chung Yin.
Source Sets	OCLC
Language	English
Detected Language	English
Source	View abstract or full-text.