Failure mechanism of lead-free Sn-Ag-Cu solder BGA interconnects

Description

Thesis (M.S.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2005. / Includes bibliographical references (leaves 70-72).

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1. http://referenc.lib.binghamton.edu:2048/login?url= http://wwwlib.umi.com/dissertations/fullcit/1432107

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Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/184842008
Date	January 2005
Creators	Dhakal, Ramji.
Source Sets	OCLC
Language	English
Detected Language	English
Type	Web sites. Electronic dissertations.
Source	Online access via UMI: