Experimental evaluation of board level solder joint reliability of plastic ball grid array assemblies with eutectic Pb-Sn and Pb-free solders /

Description

Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references (leaves 103-114). Also available in electronic version. Access restricted to campus users.

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1. http://library.ust.hk/cgi/db/thesis.pl?MECH%202003%20LUI

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Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/52054138
Date	January 2003
Creators	Lui, Hoi Wai.
Source Sets	OCLC
Language	English
Detected Language	English
Source	View Abstract or Full-Text.