PBGA reliability of lead free solder balls assembled with tin lead solder paste for harsh environment electronics

Description

Thesis(M.S.)--Auburn University, 2006. / Abstract. Vita. Includes bibliographic references.

Links & Downloads

1. http://repo.lib.auburn.edu/2006%20Summer/Theses/MITCHELL_CHARLES_16.pdf

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Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/222348471
Date	January 2006
Creators	Mitchell, Charles Clayton,
Publisher	Auburn, Ala. ,
Source Sets	OCLC
Language	English
Detected Language	English