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Boundary-Condition-Independent Reduced-Order Modeling for Thermal Analysis of Complex Electronics Packages

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Identiferoai:union.ndltd.org:OhioLink/oai:etd.ohiolink.edu:ucin1240536463
Date14 July 2009
CreatorsRaghupathy, Arun Prakash
PublisherUniversity of Cincinnati / OhioLINK
Source SetsOhiolink ETDs
LanguageEnglish
Detected LanguageEnglish
Typetext
Sourcehttp://rave.ohiolink.edu/etdc/view?acc_num=ucin1240536463
Rightsunrestricted, This thesis or dissertation is protected by copyright: all rights reserved. It may not be copied or redistributed beyond the terms of applicable copyright laws.

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