Copper surface chemistry relevant to chemical mechanical planarization (CMP) /

Description

Thesis (Ph. D.)--University of Illinois at Urbana-Champaign, 2008. / Source: Dissertation Abstracts International, Volume: 69-11, Section: B, page: 6761. Adviser: Andrew A. Gewirth. Includes bibliographical references. Available on microfilm from Pro Quest Information and Learning.

Links & Downloads

1. http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:3337930

Tags

Chemistry, Analytical.

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/436155781
Date	January 2008
Creators	Stewart, Karen Lynn.
Source Sets	OCLC
Language	English
Detected Language	English