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Wafer bonding technology for the production of dielectrically isolated silicon substrates incorporating buried metal silicide layers

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1. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.295389

Identifer	oai:union.ndltd.org:bl.uk/oai:ethos.bl.uk:295389
Date	January 1995
Creators	Goh, Wang Ling
Publisher	Queen's University Belfast
Source Sets	Ethos UK
Detected Language	English
Type	Electronic Thesis or Dissertation