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Effects of sputter deposition parameters on stress in tantalum films with applications to chemical mechanical planarization of copper /

Thesis (M.S.)--Rochester Institute of Technology, 2004. / Typescript. Includes bibliographical references (leaves 74-76).

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/60587436
Date January 2004
CreatorsPerry, Jeffrey L.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceOnline version of thesis

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