Return to search

Analýza vlivu pouzdření na izolační vlastnosti / Analyze of Packaging Impact on Insulating properties

Modern analog systems processing signals with very small amplitude are prone to distortion, which is caused by leakage between signal traces. Causation of this is contamination of insulating gap, which insulates these traces. Goal of this thesis is to design and manufacturing of test structure, which allows classification of influence of contamination on substrate on leakage, and another goal is classification of technologiacal processes in light of contamination of substrate with electroactive inpurities. Based on results of this experiments are defined rules leading to optimizing of properties of manufactured structures. Attention is applied to ceramic substrates with conductive traces which are created with thick film technology.

Identiferoai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:217978
Date January 2009
CreatorsPulec, Jiří
ContributorsHejátková, Edita, Szendiuch, Ivan
PublisherVysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Source SetsCzech ETDs
LanguageCzech
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/masterThesis
Rightsinfo:eu-repo/semantics/restrictedAccess

Page generated in 0.0077 seconds