Previous research by Rushing et al. (2002) identified key factors contributing to the formation of pinhole leaks in copper plumbing. These factors included high chlorine, pH levels and the presence of aluminum solids. Experiments were conducted to 1) examine the interplay between these constituents, 2) confirm that the water was aggressive enough to eat a hole through a pipe, 3) examine phosphate inhibition, and 4) try to determine the scope of this pitting problem in other distribution systems and on a national level.
The first set of experiments clearly defined the controversial trends from earlier work. At certain pH values, the presence of chlorine and aluminum solids does seem to initiate pitting corrosion of copper. Although the problem is most severe at higher pH, it is likely that long-term exposure at lower values such as pH 8 could lead to pitting. There is a concentration effect of aluminum solids at pH 9.0, in that higher concentrations cause an earlier rise in the potential for copper to corrode if sufficient chlorine is present.
The second phase of experiments are the first to prove that a potable water containing aluminum, high chlorine residual, and relatively high pH can cause pinholes in copper tube. To our knowledge this is the first time the phenomenon of pinhole leaks has been reproduced in the laboratory as it occurs in the field. It therefore proves that "aggressive water" alone can cause the problem of pitting. The role of flow, pipe orientation and hypothesized surface defects was directly examined as part of this evaluation. Pitting increased with greater water usage and for sections of straight pipe exposed to hydraulic conditions near bends. Copper pipe sections polished to a mirror like finish to remove surface defects were also severely attacked.
The role of phosphate in mitigation of copper pitting corrosion was defined in a subsequent experiment using synthesized water. Phosphates did not have an effect at pH 7.7 and were found to reduce electrochemical indications of pitting in the synthetic water at the pH of 8.3. Phosphates had lesser benefits at higher pH even in synthetic water, but overall, even at pHs as high as 10, some benefits from orthophosphate dosing might be anticipated.
Effects of orthophosphate on the inhibition of copper pitting corrosion were then applied to treated water from a utility in Washington D.C., whose consumers have experienced an outbreak of pinhole leaks in household copper plumbing. After comparing electrochemical results from synthetic and actual water from the treatment plant, there was evidence of a natural inhibitor to pitting corrosion in WSSC water that is not present in the synthetic water. The higher chloride concentration in the water after ferric chloride was dosed at the treatment plant may have reduced the pitting propensity of the water. The effects of phosphates seemed to reduce the pitting propensity of real water at pH 8.3 although little benefit was seen at pH 9.1.
These defined characteristics of copper pitting were then applied in a systematic evaluation of a water utility experiencing pitting corrosion in Roanoke, VA. This case study further supported the hypothesis that high levels of aluminum, chlorine, and pH may be combining to catalyze copper pitting in practice. Recommendations to alter the treatment strategies at these utilities were proposed to help mitigate the pitting corrosion problems in these areas. A national survey then confirmed pitting is occurring at a significant frequency at other large utilities across the U.S. / Master of Science
Identifer | oai:union.ndltd.org:VTETD/oai:vtechworks.lib.vt.edu:10919/35798 |
Date | 21 October 2005 |
Creators | Marshall, Becki Jean |
Contributors | Environmental Engineering, Edwards, Marc A., Vikesland, Peter J., Little, John C. |
Publisher | Virginia Tech |
Source Sets | Virginia Tech Theses and Dissertation |
Language | English |
Detected Language | English |
Type | Thesis |
Format | application/pdf |
Rights | In Copyright, http://rightsstatements.org/vocab/InC/1.0/ |
Relation | msthesis2.PDF |
Page generated in 0.0111 seconds