This work deals with issues of the wetting forces during soldering and evaluates material and procedural effects on the soldering process. The aim is to set the technology operations to get best quality of soldered joints.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:217899 |
| Date | January 2009 |
| Creators | Chloupek, Tomáš |
| Contributors | Špinka, Jiří, Starý, Jiří |
| Publisher | Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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