¡@¡@Wire bonding has been used in integrated circuit packaging for many years which has been more full-grown than other bonding methods, and gold wire has been the preferred choice. Because of the rising price of gold every year, copper wire has been increasingly used to replace gold wire.
¡@¡@The main focus of this paper is to simulate 3D copper-Al pad thermosonic wire bonding stage by using 3D finite element method. Firstly, the differences between mechanical analysis (the thermal effect was not considered) and thermo-mechanical coupling analysis from both impact stage and ultrasonic vibration stage, respectively, were compared. Secondly, the differences between copper thermosonic wire bonding analysis and gold thermosonic wire bonding analysis were discussed. Finally, the effects of Al pad thickness variation on the copper thermosonic wire bonding analysis were studied.
¡@¡@Results showed that, due to the mechanical properties will be decreased by thermal effects caused from temperature increasing, the obtained effective stress and efective strain of thermo-mechanical coupling analysis were less than the results obtained from mechanical analysis. The pad plastic defomation in copper thermosonic wire bonding is more critical than gold thermosonic wire bonding. Therefore, copper thermosonic wire bonding will lead to serious pad splashing. Also, quantity of the decreasing of pad plastic deformation was limited by increasing the pad thickness.
| Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0907110-115754 |
| Date | 07 September 2010 |
| Creators | Gau, Hua-de |
| Contributors | none, none, none, none, none |
| Publisher | NSYSU |
| Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
| Language | Cholon |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0907110-115754 |
| Rights | withheld, Copyright information available at source archive |
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