Viscoelastic polymer materials are being actively considered as a novel material for semiconductor packaging applications as a result of their ability to develop strong adhesive bonds at lower temperatures. Viscoelastic thermoset materials are impacted by the stresses generated during the curing process, which is also accompanied by a dissipation of thermal energy. There is a need to develop a generic modeling formulation that is applicable to any material of interest in order to enable the study of different bonding materials and develop optimized curing cycles. This study reports a numerical formulation to evaluate the stress generated and energy dissipated during the cure of viscoelastic polymers. A generalized method to define the transient variation of degree of cure was developed using a 4th order Runge Kutta approximation. The mathematical formulation was implemented using a novel evaluation methodology that helped reduce the computational power requirement. The commercially-available 3501-6 resin was simulated as a characteristic material in this study. The numerical model was validated against analytically derived solutions for both a single Maxwell model, and a Generalized Maxwell Model (GMM) for cases of constant-strain inputs, and subsequently for sinusoidal strain inputs, wherein, material properties were considered to be constant or varying linearly with degree of cure. A good agreement was obtained between the present model and analytical solutions.
| Identifer | oai:union.ndltd.org:pdx.edu/oai:pdxscholar.library.pdx.edu:open_access_etds-5608 |
| Date | 15 August 2018 |
| Creators | Pradeep Kumar, Anjali |
| Publisher | PDXScholar |
| Source Sets | Portland State University |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | Dissertations and Theses |
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