The thesis deals with the study and analysis of crystallographic defects on the surface of silicon wafers produced by Czochralski method. It focuses primarily on growth defects and oxygen precipitates, which play an important role in the development of appropriate nucleation centers for growth of stacking faults. The growth of stacking faults near the surface of silicon wafers is supported by their oxidation and selective etching. Such a highlighted stacking faults are known as the OISF (Oxidation Induced Stacking Fault). Spatial distribution of OISF on the wafer gives feedback to the process of pulling silicon single crystal and wafers surface quality. Moreover the work describes the device for automatic detection and analysis of OISF, which was developed for ON Semiconductor company in Rožnov Radhoštěm.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:230258 |
| Date | January 2012 |
| Creators | Páleníček, Michal |
| Contributors | Tichopádek, Petr, Urbánek, Michal |
| Publisher | Vysoké učení technické v Brně. Fakulta strojního inženýrství |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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