This work presents the bottom-up fabrication of DNA origami-assembled metal nanowires and metal-semiconductor junctions, and their electrical characterization. Integration of metal and semiconductor nanomaterials into prescribed sites on self-assembled DNA origami has facilitated the fabrication of electronic nanomaterials, whereas use of conventional tools in their characterization combines bottom-up and top-down technologies. To expand the contemporary DNA-based nanofabrication into nanoelectronics, I performed site-specific metallization of DNA origami to create arbitrarily arranged gold nanostructures. I reported improved yields and conductivity measurements for Au nanowires created on DNA origami tile substrates. I measured the conductivity of C-shaped Au nanowires created on DNA tiles (∼130 nm long, 10 nm diameter, and 40 nm spacing between measurement points) with a four-point measurement technique which revealed the resistivity of the gold nanowires was as low as 4.24 × 10-5 Ω m. Next, I fabricated DNA origami-templated metal-semiconductor junctions and performed electrical characterization. Au and Te nanorods were attached to DNA origami in an alternating fashion. Electroless gold plating was used to create nanoscale metal--semiconductor interfaces by filling the gaps between Au and Te nanorods. Two-point electrical characterization indicated that the Au--Te--Au junctions were electrically connected, with non-linear current--voltage curves. Finally, I formed metal-semiconductor nanowires on DNA origami by annealing polymer-encased nanorods. Polymer-coated Au and Te nanorods pre-attached to ribbon-shaped DNA origami were annealed at 170°C for 2 min. Gold migration occurred onto Te nanorods during annealing and established electrically continuous interfaces to give Au/Te nanowires. Electrical characterization of these Au/Te/Au assemblies revealed both nonlinear current-voltage curves and linear plots that are explained. The creation of electronic nanomaterials such as metal nanowires and metal-semiconductor junctions on DNA origami with multiple techniques advances DNA nanofabrication as a promising path toward future bottom-up fabrication of nanoelectronics.
| Identifer | oai:union.ndltd.org:BGMYU2/oai:scholarsarchive.byu.edu:etd-10050 |
| Date | 21 June 2021 |
| Creators | Aryal, Basu Ram |
| Publisher | BYU ScholarsArchive |
| Source Sets | Brigham Young University |
| Detected Language | English |
| Type | text |
| Format | application/pdf |
| Source | Theses and Dissertations |
| Rights | https://lib.byu.edu/about/copyright/ |
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