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Characterization of Vertical Interconnects in 3-D Monolithic Microwave Integrated Circuits (3-D MMIC)

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Identiferoai:union.ndltd.org:OhioLink/oai:etd.ohiolink.edu:ucin1053630359
Date01 July 2003
CreatorsKang, Qinghua (George)
PublisherUniversity of Cincinnati / OhioLINK
Source SetsOhiolink ETDs
LanguageEnglish
Detected LanguageEnglish
Typetext
Sourcehttp://rave.ohiolink.edu/etdc/view?acc_num=ucin1053630359
Rightsunrestricted, This thesis or dissertation is protected by copyright: all rights reserved. It may not be copied or redistributed beyond the terms of applicable copyright laws.

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