The effects of post-ash cleaning and chemical treatments on the dielectric properties and reliability of Cu/low-k interconnect structures

Description

Thesis (Ph. D.)--University of Texas at Austin, 2005. / Supervisor: Paul S. Ho. Vita. Includes bibliographical references.

Links & Downloads

1. http://repositories.lib.utexas.edu/bitstream/handle/2152/1826/borthakurs44073.pdf

Tags

Dielectrics. Dielectric devices. Copper

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/62260128
Date	January 2005
Creators	Borthakur, Swarnal. Ho, P. S.
Source Sets	OCLC
Language	English
Detected Language	English