Scaling and process effect on electromigration reliability for Cu/low k interconnects

Description

Thesis (Ph. D.)--University of Texas at Austin, 2007. / Vita. Includes bibliographical references.

Links & Downloads

1. http://www.lib.utexas.edu/etd/d/2007/pyunj25005/pyunj25005.pdf#page=3

Tags

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/173517732
Date	January 1900
Creators	Pyun, Jung Woo,
Publisher	[Austin, Tex. : University of Texas Libraries,
Source Sets	OCLC
Language	English
Detected Language	English