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The effects of post-ash cleaning and chemical treatments on the dielectric properties and reliability of Cu/low-k interconnect structures

Thesis (Ph. D.)--University of Texas at Austin, 2005. / Supervisor: Paul S. Ho. Vita. Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/62260128
Date January 2005
CreatorsBorthakur, Swarnal. Ho, P. S.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

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