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Application of controlled thermal expansion in diffusion bonding for the high-volume microlamination of MECS devices

Graduation date: 2005

Identiferoai:union.ndltd.org:ORGSU/oai:ir.library.oregonstate.edu:1957/30100
Date10 September 2004
CreatorsPluess, Christoph
ContributorsPaul, Brian K.
Source SetsOregon State University
Languageen_US
Detected LanguageEnglish
TypeThesis/Dissertation

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