Abstract
The behaviors of the TaNx barrier layer that placed
between the Cu metal and GaAs have been studied
by using X-ray diffraction, X-ray photoelectron
spectroscopy and scanning electron microscopy.
The TaNx and Cu films were deposited on GaAs
sequentially with RF magnetron sputter.
With a 250 nm thick TaNx barrier layer, the Cu
metal can be impeded from reacting with GaAs
substrate at 575¢Jannealed for one hour.
Within an As or Ga overpressure environment condition,
the failure temperature still occurred below 600¢J.
The failure of TaNx diffusion barrier layer for
preventing the reaction of the Cu and GaAs was originated
for the dissociation of the GaAs itself at 580¢J.
The outgoing As atoms increased the deterioration speed
of the TaNx film and reduced its blocking ability.
Identifer | oai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0620100-141802 |
Date | 20 June 2000 |
Creators | Yueh, Zhi-Wei |
Contributors | Sheng-Lung Huang, Bae-Heng Tseng, Huang-Yeu Hsieh |
Publisher | NSYSU |
Source Sets | NSYSU Electronic Thesis and Dissertation Archive |
Language | Cholon |
Detected Language | English |
Type | text |
Format | application/pdf |
Source | http://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0620100-141802 |
Rights | unrestricted, Copyright information available at source archive |
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