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Hybrid lithography fabrication of single mode optics for signal redistribution and coupling

This paper describes advances in hybrid-lithography process, combining UV-lithography for planar, single mode redistribution layer (RDL) and 2-photon-polymerization direct-laser-writing (2PP-DLW) for micro-mirrors inside RDL-opening. Improvements to multi-layer direct patterning of OrmoCore/-Clad material system using UV-lithography and need for broadband UV-LED source are presented. Near square core cross sections and smooth sidewalls are achieved. Openings in full stack with steep sidewalls without residual layer are patterned. To optimize 2PP-DLW-process processing window for both OrmoComp and IP-DIP is thoroughly characterized. Roughness measurements prove feasibility even of coarsely printed structure as reflective μ-mirror for 1550 nm wavelength. Finally these results are applied to periscope probe for wafer-level-testing of edge emitting lasers and proof of concept is shown. Outlook to further research on UV-lithography of multi-layer waveguide stack and alignment with μ-mirror printing is given.

Identiferoai:union.ndltd.org:DRESDEN/oai:qucosa:de:qucosa:91298
Date10 May 2024
CreatorsWeyers, David, Nieweglowski, Krzysztof, Bock, Karlheinz
PublisherInternational Microelectronics And Packaging Society (IMAPS)
Source SetsHochschulschriftenserver (HSSS) der SLUB Dresden
LanguageEnglish
Detected LanguageEnglish
Typeinfo:eu-repo/semantics/publishedVersion, doc-type:conferenceObject, info:eu-repo/semantics/conferenceObject, doc-type:Text
Rightsinfo:eu-repo/semantics/openAccess
Relation2380-4505, 10.4071/001c.94847, 10.23919/EMPC55870.2023.10418392, info:eu-repo/grantAgreement/Germany's Federal Ministry of Education and Research/Vertrauenswürdige Elektronik (ZEUS)/16ME0313K//Heterogene Photonik-Elektronik-Plattform für vertrauenswürdige quelloffene Prozessoren/VE-Silhouette

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