Return to search

Mechanical behavior characterization of some new materials for high density interconnect substrates

No description available.

1. http://hdl.handle.net/1853/19286
2. 484863

Identifer	oai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/19286
Date	12 1900
Creators	Rao, Yang
Publisher	Georgia Institute of Technology
Source Sets	Georgia Tech Electronic Thesis and Dissertation Archive
Detected Language	English
Type	Thesis
Rights	Access restricted to authorized Georgia Tech users only.