Analysis of electromigration in single- and dual-inlaid Cu interconnects

Description

Thesis (Ph. D.)--University of Texas at Austin, 2003. / Vita. Includes bibliographical references. Available also from UMI Company.

Links & Downloads

1. http://repositories.lib.utexas.edu/bitstream/handle/2152/685/justisonpr032.pdf
2. http://wwwlib.umi.com/cr/utexas/fullcit?p3116095

Tags

Electrodiffusion. Copper

Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/56138553
Date	January 2003
Creators	Justison, Patrick Ryan.
Source Sets	OCLC
Language	English
Detected Language	English