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Electrochemical planarization of copper for microelectronic applications /

Thesis (Ph. D.)--OGI School of Science & Engineering at OHSU, 2004. / Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/55092188
Date January 2004
CreatorsHuo, Jinshan,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceFull text open access at:

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