Return to search

Uitleg elektromagnetiese effekte in drywingselektroniese omsetters

M.Ing. / Electromagnetic Compatibility (EMC) of electronic equipment is currently an important design parameter. Layout play a significant role in the EMC of power electronic converters. This thesis describes an investigation undertaken into the electromagnetic effects of converter layout. Typical detrimental effects identified during experimental work are presented. Possible causes for these effects are discussed. The experimental work is based on a systematic approach, which starts with a basic single switch chopper and ends in a split supply half-bridge converter. Interconnection modelling and SPICE simulations of layout affects are investigated next. The focus falls on analytical equations for extraction and simplified simulation circuits to make the process generally accessible. Typical resonant frequencies present in some of the experimental circuits are investigated with the help of analytically extracted parameters. The possibility of minimizing detrimental layout effects through impedance matching of interconnections and their terminations, is investigated next, since the previous section quantified layout parameters. Distributed vs. lumped element modelling of interconnections, and the boudary in between, are discussed. Simulation and experimental results are presented. Since maximum fuctionality and power, and minimum cost, per volume drives product development, all elements of a circuit should be investigated for the possibility of realizing secondary or even tertiary functions contributing to normal circuit operation. This is the focus of the last part of this thesis. Employing interconnections as low-pass or surge filters are investigated. Several waveforms are used to test experimental interconnection structures. Lumped and distributed modelling of these strucutres are discussed. The thesis concludes with a theoretical investigation into the possibility of dissipation of surge-energy instead of reflection utilizing interconnection-structures. One of these structures utilizes the skin- and proximity effect to realize low-pass behaviour.

Identiferoai:union.ndltd.org:netd.ac.za/oai:union.ndltd.org:uj/uj:10193
Date12 September 2012
CreatorsVan Wyk, Jacobus Daniel
Source SetsSouth African National ETD Portal
Detected LanguageEnglish
TypeThesis

Page generated in 0.0023 seconds