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Power Integrity and Electromagnetic Compatibility Design for High-speed Computer Package

This thesis focuses on the modeling and solutions of the simultaneous switching noise (SSN) problems in the power delivery networks (PDN) of high-speed digital circuit packages. An efficient numerical approach based on two-dimension (2D) finite-difference time-domain (FDTD) method combined with the lumped circuit model of the interconnection is proposed to model the PDN of a package and PCB. Based on this approach, the mechanism of noise coupling between package and PCB can be analyzed. In addition, a novel photonic crystal power layer (PCPL) design for the PDN of the package or PCB is proposed to suppress the SSN. The periodic High-Dk material is embedded into the substrate layer between the power and ground planes. Both modeling and measurement demonstrate the PCPL can form a wide stopband well with excellent suppression of the SSN propagation in the substrate and the corresponding electromagnetic interference (EMI).

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0703106-102106
Date03 July 2006
CreatorsChen, Sin-Ting
ContributorsSheng-Fuh Chang, Chih-Wen Kuo, Tzyy-Sheng Horng, Tzong-Lin Wu, Ruey-Beei Wu, Ruey-Bing Hwang, Kin-Lu Wong, Huey-Ru Chuang
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageEnglish
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0703106-102106
Rightswithheld, Copyright information available at source archive

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