Modeling and process optimization of solder paste stencil printing for micro-BGA and fine pitch surface mount assembly /

Description

Thesis (Ph. D.)--Lehigh University, 2000. / Includes vita. Includes bibliographical references (leaves 101-106).

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Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/46955617
Date	January 2000
Creators	Pan, Jianbiao,
Source Sets	OCLC
Language	English
Detected Language	English
Type	Academic dissertations