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A selective encapsulation solution for packaging an optical micro electro mechanical system

Thesis (M.S.)--Worcester Polytechnic Institute. / Keywords: packaging; micro electro mechanical systems; MEMS; electronics; die warpage; die bow; encapsulant; encapsulate; electrochemical migration; corrosion; wirebonds. Includes bibliographical references (p. 94-99).

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/55848119
Date January 2002
CreatorsBowman, Amy Catherine.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceLink to electronic thesis.

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