Die stress analysis in plastic encapsulated electronic packages an experimental and numerical approach /

Description

Thesis (Ph. D.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2006. / Includes bibliographical references (leaves 121-136).

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1. http://proxy.binghamton.edu/login?url= http://wwwlib.umi.com/dissertations/fullcit/3241623

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Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/226376936
Date	January 2006
Creators	Chaparala, Satish Chandra.
Source Sets	OCLC
Language	English
Detected Language	English
Type	Web sites. Electronic dissertations.
Source	Online access via UMI: