Development of convective reflow-projection moire warpage measurement system and prediction of solder bump reliability on board assemblies affected by warpage

Description

Thesis (Ph. D.)--Mechanical Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Dr. Ume, I. Charles; Committee Member: Dr. Book, Wayne; Committee Member: Dr. Kim, Yeong; Committee Member: Dr. Pan, Jiahui; Committee Member: Dr. Sitaraman, Suresh; Committee Member: Dr. Wu, C. F. Jeff.

Links & Downloads

1. http://hdl.handle.net/1853/22600

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Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/268966406
Date	January 2008
Creators	Tan, Wei.
Publisher	Atlanta, Ga. : Georgia Institute of Technology,
Source Sets	OCLC
Language	English
Detected Language	English
Source	Available online, Georgia Institute of Technology: