Return to search

Thermal stress analysis of electronic packaging /

Thesis (M. App. Sc.)--Carleton University, 2004. / Includes bibliographical references (p. 104-105). Also available in electronic format on the Internet.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/290647364
Date January 1900
CreatorsAldea, Victor,
PublisherOttawa,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
SourceProQuest Full Text

Page generated in 0.0018 seconds