Thermal deformation of electronic packages and packaging effect on reliability for copper/low-k interconnect structures

Description

Thesis (Ph. D.)--University of Texas at Austin, 2004. / Supervisor: Paul S. Ho. Vita. Includes bibliographical references.

Links & Downloads

1. http://repositories.lib.utexas.edu/bitstream/handle/2152/2082/wangg042.pdf

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Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/68813299
Date	January 2004
Creators	Wang, Guotao, Ho, P. S.
Source Sets	OCLC
Language	English
Detected Language	English