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Die stress analysis in plastic encapsulated electronic packages an experimental and numerical approach /

Thesis (Ph. D.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2006. / Includes bibliographical references (leaves 121-136).

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/226376936
Date January 2006
CreatorsChaparala, Satish Chandra.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
TypeWeb sites. Electronic dissertations.
SourceOnline access via UMI:

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