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Characterization of die stresses in large area array flip chip packages

Thesis (M.S.)--Auburn University, 2008. / Abstract. Vita. Includes bibliographical references (p. 134-144).

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/234540132
Date January 2008
CreatorsRoberts, Jordan Christopher, Jaeger, Richard C., Suhling, J. C.
PublisherAuburn, Ala.,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

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