Yes / A numerical study in 3-D is performed using water as a cooling fluid to investigate the one phase natural convection heat transfer within enclosure. A heat source representing a computer CPU mounted on one vertical wall of a rectangular enclosure is simulated while a heat sink is installed on the opposite vertical wall of the enclosure. The air flow inside the computer compartment is created by using an exhaust fan, and the flow is assumed to be turbulent. The applied power considered ranges from 15 40 W. In order to determine the thermal behaviour of the cooling system, the effect of the heat input and the dimension of the enclosure are investigated. The results illustrate that as the size of the enclosure increase the chip temperature declined. However the drop in the temperature is very small when the width increased more than 50 mm. When the enclosure was filled with water the temperature was reduced by 38%. Also the cooling system maintains the maximum chip temperature at 71.5 C when the heat input of 40 W was assumed and this is within the current recommended computer electronic chips temperature of no more than 85 degrees C.
| Identifer | oai:union.ndltd.org:BRADFORD/oai:bradscholars.brad.ac.uk:10454/10636 |
| Date | January 2014 |
| Creators | Gdhaidh, Farouq A.S., Hussain, Khalid, Qi, Hong Sheng |
| Source Sets | Bradford Scholars |
| Language | English |
| Detected Language | English |
| Type | Article, Published version |
| Rights | (c) 2014 The Authors. This is an Open Access article distributed under the Creative Commons CC-BY license (http://creativecommons.org/licenses/by/3.0), CC-BY |
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