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Novel diffusion barrier layers for advanced copper interconnect metallization

No description available.
Identiferoai:union.ndltd.org:up.pt/oai:repositorio-aberto.up.pt:10216/136760
Date22 October 2021
CreatorsLiliane Cristina Gonçalves Savaris
ContributorsFaculdade de Engenharia
Source SetsUniversidade do Porto
LanguageEnglish
Detected LanguageEnglish
TypeDissertação
Formatapplication/pdf
RightsopenAccess

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