The arrival of high-speed, large-area IC's forces development of packages with high-density, small cross-sectional wiring. This trend is particularly clear for packages housing many chips (MCM's). It is shown how electrical, thermal, and fabricational constraints control line geometry in MCM's forcing the use of lossy lines. To obtain high speeds with these lossy lines, a generalized impedance-matched design is to combine load, line, and driver for overshoot-controlled performance. Using overshoot control, tradeoffs among power, area, and performance are derived for low-impedance buffers and drivers useful for lossy lines in MCM's.
| Identifer | oai:union.ndltd.org:arizona.edu/oai:arizona.openrepository.com:10150/278048 |
| Date | January 1991 |
| Creators | Mi, Wei, 1960- |
| Contributors | Brews, John R. |
| Publisher | The University of Arizona. |
| Source Sets | University of Arizona |
| Language | en_US |
| Detected Language | English |
| Type | text, Thesis-Reproduction (electronic) |
| Rights | Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author. |
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