Copper aluminosilicate (composition Cu₂O·Al₂O₃·6SiO₂) glass was melted in an alumina crucible at 1500°C and air cooled in situ. A layer of cupric oxide was grown on the polished glass surface and its thickness measured using a scanning electron microscope (SEM). The thickness of the oxide layer was found to increase parabolically with time, with a temperature dependency that was compatible with the diffusion of copper through the layer. The cupric oxide layer was reduced to copper on roughened and polished glass surfaces using a gas mixture of 3% H₂ and 97% N₂, resulting in a glass substrate coated by copper. Adherence of the copper layer to the polished glass substrate was found to be poor. However, adherence was found to increase by roughening the surface before oxidation. Additions of NiO and CaO to the base glass were not detrimental to the production of the copper film.
| Identifer | oai:union.ndltd.org:arizona.edu/oai:arizona.openrepository.com:10150/278284 |
| Date | January 1993 |
| Creators | Beatty, Kirk Matthew, 1962- |
| Contributors | Lynch, David C. |
| Publisher | The University of Arizona. |
| Source Sets | University of Arizona |
| Language | en_US |
| Detected Language | English |
| Type | text, Thesis-Reproduction (electronic) |
| Rights | Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author. |
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