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Diffusion kinetics and microstructure of eutectic and composite solder/copper joints

Thesis (Ph.D.)--University of North Texas, 1994. / Includes bibliographical references.

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/85804078
Date January 1994
CreatorsWu, Yujing.
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish
Sourceaccess full-text online access from Digital dissertation consortium

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