Modal analysis of printed circuit board results, gained from computional and experimental modeling, have been compared. Anylyses have been performed on dummy boards (models without electronic components), created as one-layered at first, then as three-layered PCB. Board is usually clamped by its longer edges with wedgelock. In order to enable the realization of boundary conditions in computional and experimental modeling, real clamping has been simplified to simply supported. Computional models have used FEM elements, which are comomnly used in this type of problem. Determined results have been evaluated by comparing the experimental modeling results. Models‘ sensitivity on modification of element length and number of elements through thickness have been performed.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:232000 |
| Date | January 2015 |
| Creators | Oplt, Tomáš |
| Contributors | Vosynek, Petr, Tošovský, Jiří |
| Publisher | Vysoké učení technické v Brně. Fakulta strojního inženýrství |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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