The main goal of this work is to find a methodology of the fabrication of microcompressive specimens (pillars) from thin metallic film prepared by means of PVD. The studied film was prepared by the ON Semiconductor company, Roznov pod Radhostem. Its chemical composition was Al-1.5 wt.% Cu; such films are used for electric connections on integrated circuits. At first, a thin intermediate layer of W-10 wt.% Ti was deposited on the Si single crystalline substrate with the purpose of improving adhesion properties of the studied film. The geometry of the microcompressive specimen should be as close to the cylindrical shape as possible. The height of the cylinder is given by the film thickness, its diameter is approximately 1 m. Such specimens were prepared in Quanta 3D FEG Dual BeamTM facility using focused ion beams technology. Experiments were done at FEI Company in Brno. In total, 39 microcompressive specimens were prepared at various ion milling conditions. The required geometry was finally attained by the optimization of processing parameters, in particular the parallelism of lateral faces was improved, the bottom of the removed zone in the vicinity of the pillar was almost flat and the transition pillar – flat bottom was regular. The prepared pillars are suitable for the microcompression tests; the first of them have been already performed within the cooperation with the Institut of Physics, Academy of Sciences of the Czech Republic, Praha.
| Identifer | oai:union.ndltd.org:nusl.cz/oai:invenio.nusl.cz:228055 |
| Date | January 2008 |
| Creators | Kuběna, Ivo |
| Contributors | Švejcar, Jiří, Kruml, Tomáš |
| Publisher | Vysoké učení technické v Brně. Fakulta strojního inženýrství |
| Source Sets | Czech ETDs |
| Language | Czech |
| Detected Language | English |
| Type | info:eu-repo/semantics/masterThesis |
| Rights | info:eu-repo/semantics/restrictedAccess |
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