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In-process stress analysis of flip chip assembly and reliability assessment during environmental and power cycling tests

No description available.
Identiferoai:union.ndltd.org:GATECH/oai:smartech.gatech.edu:1853/5442
Date01 December 2003
CreatorsZhang, Jian
PublisherGeorgia Institute of Technology
Source SetsGeorgia Tech Electronic Thesis and Dissertation Archive
Languageen_US
Detected LanguageEnglish
TypeDissertation
Format12060879 bytes, application/pdf

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