Strain measurement of flip-chip solder bumps using digital image correlation with optical microscopy

Description

Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2009. / Includes bibliographical references.

Links & Downloads

1. http://proxy.binghamton.edu/login?url= http://wwwlib.umi.com/dissertations/fullcit/1467400

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Additional Fields

Identifer	oai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/456080301
Date	January 2009
Creators	Lee, Dong Gun.
Source Sets	OCLC
Language	English
Detected Language	English
Type	Electronic books. Electronic dissertations.
Source	Online access via UMI: