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Shearing Behavior of Lead Free Solder Bumps

The trend of electrical products is light, thin and minimized with the fast operation and multi functionality, which also drives assembly technology towards the same goal. In advanced assembly technology, flip-chip is the one that can achieve the purposes. The pitch and size of a bump, which is in charge of current transmit, are also getting small. The prohibition of using lead content material also stimulates the development of lead-free material in the related industries.
The paper is focused on adopting lead free solder paste such as Sn/Ag1.0/Cu0.5 and Sn/Ag4.0/Cu0.5, together with Al/NiV/Cu UBM made by bumping technology. The empirical analysis is based the shear strength of three different bump heights. The result shows the higher the content of Ag, the higher of the initial shear strength. Moreover, the experiment also investigated two solder bump IMC conditions and shear strength by using multi-reflow. The result shows that the IMC of Sn/Ag4.0/Cu0.5 solder paste increases after times of multi-reflow, but the shear strength was sharply decreased. The reliability test was also performed, such as temperature cycling test, temperature and humidity test, highly accelerated temperature and humidity stress test, high temperature storage life test. It¡¦s found the Sn/Ag1.0/Cu0.5 solder bump could maintain the original ductility; while the Sn/Ag4.0/Cu0.5 solder bump was decreasing the ductility due to the generation of IMC.
Keyword¡GShear Strength, Flip-chip, Bump, IMC

Identiferoai:union.ndltd.org:NSYSU/oai:NSYSU:etd-0130107-181201
Date30 January 2007
CreatorsLin, Chien-Hung
ContributorsJen, Ming-Hwa R., Liu, Chorng-Fuh, none
PublisherNSYSU
Source SetsNSYSU Electronic Thesis and Dissertation Archive
LanguageCholon
Detected LanguageEnglish
Typetext
Formatapplication/pdf
Sourcehttp://etd.lib.nsysu.edu.tw/ETD-db/ETD-search/view_etd?URN=etd-0130107-181201
Rightsnot_available, Copyright information available at source archive

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