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Flip chip and heat spreader attachment development

Thesis (Ph. D.)--Auburn University. / Abstract. Includes bibliographical references (p. 91-100).

Identiferoai:union.ndltd.org:OCLC/oai:xtcat.oclc.org:OCLCNo/424631483
Date January 2009
CreatorsLi, Yuquan. Johnson, Robert Wayne,
PublisherAuburn, Ala.,
Source SetsOCLC
LanguageEnglish
Detected LanguageEnglish

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